Optical EchoProbe 413光学反射探针
Latest Optical Technique
最新的光学技术
Ideal solution for Wafer Backgrind and Etch Thickness Gauging on Si, GaAs or III-Vs, non-conducting materials like Glass, Tape
硅片背面研磨蚀刻厚度测量最理想方案用于Si, GaAs或者III-Vs,非导电材料比如玻璃，胶带
Optical EchoProbe Technology光学反射探针技术
Low Coherence Interferometry (other than classical interferometry) is suitable for rough surfaces even in the case of speckle imaging. This makes it interesting for industrial use.
低相干干扰量度法（不同于传统的干扰量度法）适用于粗糙表面，甚至是斑点图象。这另它适用于工业使用。
Fiber-optic implementation of Michelson interferometer LS with low coherence light source
低凝聚光源的迈克尔逊干涉仪光纤启用
Light source:光源
Superluminescent broad band Diode Center Wavelength 1315 nm
Bandwidth >50 nm超发光宽频二极管中心波长1315nm频宽>50nm
Optical EchoProbe Technology: Measured Signal
光学反射探针技术：测量信号
When optical lengths of reference beam path and sample beam path are
equal then Interference signal is observed
当参考光束路径和式样光束路径光程长等同时，观测干扰信号
Bare Si Wafer裸硅片
Wafer with Tape胶带硅片
Silicon Wafer with Metal Layer and Tape金属层和胶带硅片
Solution: Dual Probe Head for non-transparent samples
方法：不透明样例，双探针头
Vibration in-sensitive Setup振动感应装置
thermal drift eliminated消除热飘移
●Synchronized Low Coherence Michelson Dual Interferometer干扰迈克尔逊双干扰仪
●Arrangement of two Probe Heads with synchronized low coherence dual interferometer in configuration
调整已经同步的干扰迈克尔逊双干扰仪两个探针头
●optimized for reduction of vibration noise
最大的减少振动噪声
W-Wafer, M-Mirror, MI-Michelson Interferometer, TMS moving stage/scanning mirror
Comparison of Single and Dual Probe Interferometry
单/双探针干扰量度法比较
● Single probe system samplerequirements单探针系统样本要求
– Smooth surfaces, homogenousmaterials光滑表面，材料均匀
– Transparent substrate material透明基板材料
– Known refractive indices已知的折射指数
●Dual probe system providessolution for双探针系统适用
– Nontransparent samples
– Samples with unknown refractive indices
–非透明样本
–未知折射指数
Applications应用
●Wafer Thickness and TTV硅片厚度和TTV
●Topography构状
●Strained wafers已变形的硅片
●Profile depth轮廓深度
●Measurement of Tape胶带测量
●Warp翘曲
●Bump Height凸起高度
●Ultra Fast Measurements超快速测量